Kinsus Interconnect Technology, known for its IC substrate maker has acquired a plant and related facilities from the bankrupt Chunghwa Picture Tubes (CPT) worth NT$1.5 billion.
Kinsus is expected to use the factory to expand its production capacity mainly for Ajinomoto Build-up Film (ABF) substrates, which have been in short supply amid fast growing demand.
Ajinomoto Build-up Film (ABF) can be found at the heart of most of the world's personal computers, where it provides electrical insulation of complex circuit substrates for high-performance central processing units (CPUs).
Kinsus' monthly production capacity has increased to 12 million ABF substrates. The company plans to further expand the monthly production capacity to 16 million substrates in 2021.
Kinsus Interconnect Technology Corp. manufactures BGA (Ball Grid Array) boards. The Company's products include PBGA (Plastic BGA), MCM (Multi Chip Module) BGA, Mini BGA, TEBGA (Thermal Enhanced BGA), and flip chip substrate boards.
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